HOPERF is committed to being a leading manufacturer of IoT key components for wireless radio frequency and sensor R&D, packaging, testing, service and customization
R&D
ASIC chip design, independent NEXTGENRF patent algorithm, senior R&D team, 26 national patents and 9 software copyrights
Package
The original equipments from US, Japan or Germany with unique packaging and calibration process to ensure high consistency
Testing
14 Reliability Tests, including of high-low temperature, vibration test, drop test, etc.
Service
With 20 years of industry experience, covering 33 countries in the world, serving more than 3000 brand customers
Customization
Wireless RF and sensor customized development, provide personalized service to meet the differentiated needs of customers
R&D
ASIC chip design, independent NEXTGENRF patent algorithm, senior R&D team, 26 national patents and 9 software copyrights
Package
The original equipments from US, Japan or Germany with unique packaging and calibration process to ensure high consistency
Testing
14 Reliability Tests, including of high-low temperature, vibration test, drop test, etc.
Service
With 20 years of industry experience, covering 33 countries in the world, serving more than 3000 brand customers
Customization
Wireless RF and sensor customized development, provide personalized service to meet the differentiated needs of customers