With the deep synergy between embedded systems and IoT technologies, global industry professionals will once again focus their attention on Embedded World 2026 in Nuremberg, Germany .

From March 10th to 12th, Embedded World will continue to comprehensively showcase the innovative achievements of the entire embedded industry chain, including hardware, systems, distribution, services, tools, application software, electronic displays, embedded vision, security protection, and M2M, providing guidance and clarifying the direction for industry development.

HOPERF Booth: HALL 3A, Booth 526

At the event, HOPERF, an IoT system-level service provider integrating RF chip design, firmware and protocol design, application development and testing, will make a grand appearance at booth 526 in Hall 3A. The company will showcase its latest solutions and core technological achievements in Sub-GHz RF chips/modules, digital sensors, BLE chips/modules, Matter modules and their digital isolators to global attendees, empowering global customers to build a smarter and more efficient IoT future.

Booth Highlights Preview

◆ Wireless Radio Frequency Communication Solution

Our full range of Sub-GHz RF transceiver chips and modules supports mainstream protocols such as LoRa and Wi-SUN, and comes with complete development kits to meet the needs of long-distance, low-power wireless communication.

◆ Industrial Sensing Solutions

High-precision industrial-grade digital sensors for temperature, humidity, and air pressure are suitable for various applications such as industrial monitoring and environmental sensing.

◆ Bluetooth communication solution

The full range of BLE chips and modules supports multiple versions of Bluetooth protocols from 5.X to 6.X, while also ensuring low power consumption, high stability, and broad compatibility.

◆ Smart Home Solutions

The Matter Over Thread/Wi-Fi module helps devices quickly achieve cross-platform interconnection and embrace a unified smart home interconnection standard.

◆ Electrical isolation solution

A series of chips, including digital isolators, isolation drivers, isolation interfaces, and isolation sampling, provide highly reliable electrical safety protection for industrial control and power systems.

It's worth mentioning that during the exhibition, HOPERF' senior engineering team will be stationed at booth 526 in Hall 3A to provide professional one-on-one consultation services to every attendee, including:

Technical Explanation: A detailed introduction to the working principles, performance characteristics, and competitive advantages of HOPERF's various product series.

Application Case Sharing: Sharing successful application cases of HOPERF's various product series in different industries.

We provide solutions: We offer professional technical advice and solutions tailored to your specific needs and the specific problems encountered in their implementation, and we jointly explore the possibilities and areas for cooperation in product customization.

HOPERF cordially invites global customers and partners to visit our booth (Hall 3A, Booth 526) to analyze innovation trends in the embedded systems field, explore potential collaborations, and jointly envision a new blueprint for the development of the Internet of Things (IoT) industry!

We look forward to working with you to build a new intelligent IoT ecosystem and create a better future!