0086-4001-189-180
中文
English
About Us
Brand Introduction
R & D Team
Company History
The Quality
Qualification & Patent
Recruitment
About UsAbout us

Leading Manufacturer of IoT Key Components


Shenzhen HOPE Microelectronics Co., Ltd (hereinafter referred to as "HOPERF"), founded in 1998, it is a national level high tech company which specialized in the design and manufacture wireless radio frequency and sensor products. With a global operation comprising a vertically integrated factory, HOPERF has developed into the first intact industry chain group company in China which integrating ASIC chip design, MEMS sensor chip design, package test calibration technique and application services.


HOPERF has a top R&D team with more than 80 global employees, and 60% of them are professionals that from international top-grade enterprises in Germany, United States, Switzerland, etc. HOPERF has multiple international leading technologies in internet-of-thing field, and the unique patent "NextGenRF" algorithm in chip design aspect can fill up the blank in domestic. It also got 8 enterprise certifications, 26 special inventions and 9 software copyrights.


HOPERF has a 30,000 square meters’ modern manufactory in Wuxi Taihu Technology Park and imported advanced top-ranking encapsulation & testing equipments with high-precision test measuring system which can perform strictly production management according to ISO9001 thus to fully ensure the reliability and stability of product quality.


Our sensor production lines mainly included the Digital Barometric Sensors, Digital Temperature and Humidity Sensors or Modules, Customized Sensors, etc. We are good at providing custom design sensors and customized sensor solutions for special applications to our customers. Compliance with ROHS and other standards that assured by the top of the range SMT machinery, fully automated assembly, testing and oven reflow. Our factory is vertically integrated to perform such processes as Wafer Release, MEMS die attach, automation inorganically bonded, encapsulation and test, calibration…through all phases of the processes. A fully integrated company and manufacturing management system allows us to provide our customers with complete project management. We are well-placed to handle OEM projects and more standard sensor requirements for customers from world- wide. We have abilities to realize fast delivery and provide technical supports after-sales.


HOPERF's products have already applied in 33 countries and served for more than 1000 brand customers from world-wide. Our products were comprehensively applied in Outdoor Sport, Electronic Navigation, Industrial Measurement, Environmental Monitoring, Medical, Smart Health, Diving and Aircraft etc.


26Inventions
26 Special Inventions
9 Software Copyrights
9 Software Copyrights
80+R&D team
Top R&D team with more than 80 global employees
Brand IntroductionBrand introduction

The first brand of pressure sensor in China. Including absolute pressure, differential pressure, gauge pressure, oil filling and custom sensor

Get the latest chip design technology of digital-analog hybrid

Headquarter in Shenzhen ( R & D Team) and Industrial Base in Wuxi

The only complete industrial chain company in China with ASIC chip, MEMS sensor chip design, packaging test and calibration technology application service in one

National level hi-tech enterprise of chip design

20 years of experience in the industry, products covering 33 countries in the world, and serving more than 2000 brand customers

Got 8 enterprise certifications, 26 special inventions and 9 software copyrights

The first brand of digital analog hybrid RF chip design in domestic

Reasearch TeamReaearch Team
Our mission
Greatly shorten the development cycle, and to create maximum convenience for customers!

HOPERF has a top R&D team with more than 80 global employees, and 60% of them are professionals that from international top-grade enterprises in Germany, United States, Switzerland, etc. HOPERF has multiple international leading technologies in internet-of-thing field, and the unique patent "NextGenRF" algorithm in chip design aspect can fill up the blank in domestic.

Company historyCompany history
2018-Now Set sail a new journey, to compete with international brand Set sail a new journey, to compete with international brand in 2018. And strive to become the leading manufacturer of IoT key components.
2018-Now
2013-2018 High tech products had been released, and the performance in high speed 2013-2014 get the benefit from IoT industry, to achieve a better performance. And became a leading manufacturer of IoT key components. 2016-2017 the new products of ultra small volume bidirectional chip and high-precision sensor was put into mass production, so the performance continues to grow at a high speed.
2013-2018
2008-2013 Got a great breakthrough in chip design In 2009, the second generation of ASIC and MEMS chip design has get the independent intellectual property right thus to make a significant breakthroughs to fill the gap in China. In 2010, the chip design R & D center of the CMOSTEK and the HEPURI large industrial base were established in Taihu, Wuxi.
2008-2013
2003-2008 Focus on the field of radio frequency and sensor Design a new generation of digital sensor chip and ASK/FSK RF chip and module.
2003-2008
1998-2003 HOPERF was founded, and enter into RF field HOPERF was founded in 1998 then enter into RF field, and develop rapidly.
1998-2003
2018-Now Set sail a new journey, to compete with international brand Set sail a new journey, to compete with international brand in 2018. And strive to become the leading manufacturer of IoT key components.
2018-Now
2013-2018 High tech products had been released, and the performance in high speed 2013-2014 get the benefit from IoT industry, to achieve a better performance. And became a leading manufacturer of IoT key components. 2016-2017 the new products of ultra small volume bidirectional chip and high-precision sensor was put into mass production, so the performance continues to grow at a high speed.
2013-2018
2008-2013 Got a great breakthrough in chip design In 2009, the second generation of ASIC and MEMS chip design has get the independent intellectual property right thus to make a significant breakthroughs to fill the gap in China. In 2010, the chip design R & D center of the CMOSTEK and the HEPURI large industrial base were established in Taihu, Wuxi.
2008-2013
2003-2008 Focus on the field of radio frequency and sensor Design a new generation of digital sensor chip and ASK/FSK RF chip and module.
2003-2008
1998-2003 HOPERF was founded, and enter into RF field HOPERF was founded in 1998 then enter into RF field, and develop rapidly.
1998-2003
The QualityThe quality

Standardizing materials and process for electrical and products and to make it more conducive to human health and environmental protection.

Increasing open politics of using chemicals. Advocating non-animal experiments. Pursuing sustainable social development.

Using standards to define products and to conduct production.

Certified by ISO 9001 :2000;Pb-free & RoHS-compatible;SGS Certification;REACH Certification;ETSI

To strengthen quality management, improve enterprise efficiency, enhance customer confidence and to expand market share

SMT Reflow Soldering Equipment
SMT Chip Mounter
100000 Level Dust-free Workshop
Testing and Measuring Instruments
Qualification & PatentQualification patents
江苏省科技型中小企业
集成电路设计企业认证
江苏省科技型中小企业
高新技术企业
江苏省民营科技型企业
外观设计专利证书
国家级高新技术企业
江苏民营科技企业
实用新型专利证书
ISO中文证书
半导体协会证书
江苏省科技型中小企业
集成电路设计企业认证
江苏省科技型中小企业
高新技术企业
江苏省民营科技型企业
外观设计专利证书
国家级高新技术企业
江苏民营科技企业
实用新型专利证书
ISO中文证书
半导体协会证书
Recruitment

Talent recruitment

HOPERF is an exciting company full of great people who are enthusiastic, hard-working and enjoy working in a friendly team enviroment. If you are willing to join our company, you will be part of the dynamic team that we are building as the foundation of the company's future success. Our journey will be both challenging and rewarding. We also provide for employee health and welfare by offering competitive and comprehensive employee benefits.


At present, the company mainly recruits the following personnel:

A、Job Title: Senior Application Engineer


Qualifications:


1、Minimum 3 year professional experience in wireless radio frequency

2、Strong knowledge of EMC, FCC quality system

3、Strong knowledge of high-frequency instrument, such as network analyzer,  noise analyzer, phase-locked loop analyzer,              signal generator, spectrum analyzer

4、Good skill of drawing board software, such as PADS, PROTEL

5、Good skill of RF simulation software,such as PADS, HFSS, ANSOFT

6、Good skill of the C programming language have a good command of English


We will read every self-introduction letter and resume carefully, because we have received a large number of application letters, unable to reply one by one, please forgive me! To help us streamline recruitment, please send your cover letter to the following address.

hr1@foshk.com

Professional RF&SENSOR Designer and Manufacturer
Copyright ©2018 HOPE Microelectronics CO., Ltd. All rights reserved.