Silicon/Glass bonding Pressure Sensor - HSG_Module

Thanks for your participation and support,If you have interest in our products,please give us an order form or Feedback to us.

Datasheet:

Click here to view Datasheet

Description

The HSGXX SMD pressure sensor series is designed for pressure sensor systems with highest demands on resolution and accuracy. The device consists of Hope's pressure sensor die mounted on a 6.3 x 6.9 mm FR4 or ceramic carrier protected by a metal cap. The HSGXX can be delivered in differencial pressure range mode.

Features

• Silicon Glass Bonding wafer, high reliability
• Low cost SMD FR4 carrier or ceramic package
• -40°C to +125 °C operation range
• Standard overpressure range: 15psi;100psi;200psi
• Gel protection against humidity and water
• Small size
• High reliability, low drift

Application

• Absolute pressure sensor systems
• Engine controls
• High resolution altimeters, variometers
• Water proof watches and diver's computers
• Barometers
• Tire pressure monitoring systems (TPMS)